近日,安徽禾臣新材料有限公司完成过亿元B轮融资,由国泰君安创新投资与中车国创基金联合领投,金圆资本、派维投资等产业方共同投资,资金将主要用于8.6代空白掩模版(Blank Mask,光掩模版基板)与半导体先进制程抛光垫产能扩充,同时加大与战略客户研发配套投入,以满足市场需求。
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