北京
分享至
据港交所文件：江苏芯德半导体科技股份有限公司向港交所提交上市申请书。
本文源自：金融界AI电报
特别声明：以上内容(如有图片或视频亦包括在内)为自媒体平台“网易号”用户上传并发布，本平台仅提供信息存储服务。
Notice: The content above (including the pictures and videos if any) is uploaded and posted by a user of NetEase Hao, which is a social media platform and only provides information storage services.
