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HBM产品已成为DRAM产业关注焦点，这使得Hybrid Bonding (混合键合)等先进封装技术发展备受瞩目。根据TrendForce集邦咨询最新研究，三大HBM原厂正在考虑是否于HBM4 16hi采用Hybrid Bonding，并已确定将在HBM5 20hi世代中使用这项技术。
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近年来，产业界对固态电池应用的追求与期盼加速了这项技术的商业化进程。根据TrendForce集邦咨询最新调查，丰田、日产、三星SDI等全球制造商已开始试制全固态电池，随着业者竞相量产，预估产量可于2027年前达GWh (吉瓦时)水平。
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