近日,北京铭镓半导体有限公司顺利完成A++轮超亿元股权融资,由彭程创投、成都科创投、天鹰资本联合领投,国煜基金及洪泰基金等多家机构联合注资。本轮融资1.1亿元,投后估值9.1亿元,至此,铭镓已完成5轮,总融资金额合计接近4亿元。
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